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Document by Parts
Click on Affected MM Number to view Milestones
Click to expand all rows.PCN NumberPCN TitleProduct CategoriesAffected MM NumberProduct CodePost Change Product CodePost Change MM NumberAffected S-SpecPost Change S-Spec
108974-00
Heat Sink for Select Intel Boxed Processors, PCN 108974-00, Product Material, Machine Surface Modification
Desktop Processors, Server Processors
895734BX80570E8200 S LAPP  
S LAPP
 
108934-00
Land Grid Array (LGA) Microprocessor, LGA771/LGA775/FC-LGA6 Cover Removal, PCN 108934-00, Product Material
Desktop Processors, Embedded Processors, Mobile Processors, Server Processors
895734BX80570E8200 S LAPP  
S LAPP
 
108966-00
Intel(R) Core(TM)2 Duo Processors E8200 & E8190, PCN 108966-00, Product Discontinuance, Product Discontinuance for Tray and Boxed Products
Desktop Processors
895734BX80570E8200 S LAPP  
S LAPP
 
108966-00
Intel(R) Core(TM)2 Duo Processors E8200 & E8190, PCN 108966-00, Product Discontinuance, Product Discontinuance for Tray and Boxed Products
Desktop Processors
895734BX80570E8200 S LAPP  
S LAPP
 
108112-01
All Intel(R) Component Products shipped in JEDEC trays using the Intermediate Box (I-Box) Packaging, PCN 108112-01, Transport Media, Added Handle with Care graphics to the I-box., Reason for Revision: Added customers for notification
Desktop Processors, Embedded Processors, Microcontrollers, Mobile Processors, Networking Products, Server Processors, Chipsets - Desktop, Chipsets - Workstation Server, Chipsets - Mobile
895734BX80570E8200 S LAPP  
S LAPP