 | 108934-00 | Land Grid Array (LGA) Microprocessor, LGA771/LGA775/FC-LGA6 Cover Removal, PCN 108934-00, Product Material | Desktop Processors, Embedded Processors, Mobile Processors, Server Processors | 888210 | HH80557PG0412M | | | S LA3F | |
 | 108934-00 | Land Grid Array (LGA) Microprocessor, LGA771/LGA775/FC-LGA6 Cover Removal, PCN 108934-00, Product Material | Desktop Processors, Embedded Processors, Mobile Processors, Server Processors | 888210 | HH80557PG0412M S LA3F | | | S LA3F | |
 | 108934-00 | Land Grid Array (LGA) Microprocessor, LGA771/LGA775/FC-LGA6 Cover Removal, PCN 108934-00, Product Material | Desktop Processors, Embedded Processors, Mobile Processors, Server Processors | 888210 | HH80557PG0412M,SLA3F,888210 | | | S LA3F | |
 | 108644-00 | All Intel(R) Central Processor Unit Products Packed in Thermoform Trays, PCN 108644-00, Transport Media, addition of second source for the thermoform tray | Desktop Processors, Embedded Processors, Mobile Processors, Server Processors | 888210 | HH80557PG0412M | | | S LA3F | |
 | 108644-00 | All Intel(R) Central Processor Unit Products Packed in Thermoform Trays, PCN 108644-00, Transport Media, addition of second source for the thermoform tray | Desktop Processors, Embedded Processors, Mobile Processors, Server Processors | 888210 | HH80557PG0412M S LA3F | | | S LA3F | |
 | 108644-00 | All Intel(R) Central Processor Unit Products Packed in Thermoform Trays, PCN 108644-00, Transport Media, addition of second source for the thermoform tray | Desktop Processors, Embedded Processors, Mobile Processors, Server Processors | 888210 | HH80557PG0412M,SLA3F,888210 | | | S LA3F | |
 | 108112-01 | All Intel(R) Component Products shipped in JEDEC trays using the Intermediate Box (I-Box) Packaging, PCN 108112-01, Transport Media, Added Handle with Care graphics to the I-box., Reason for Revision: Added customers for notification | Desktop Processors, Embedded Processors, Microcontrollers, Mobile Processors, Networking Products, Server Processors, Chipsets - Desktop, Chipsets - Workstation Server, Chipsets - Mobile | 888210 | HH80557PG0412M | | | S LA3F | |
 | 108112-01 | All Intel(R) Component Products shipped in JEDEC trays using the Intermediate Box (I-Box) Packaging, PCN 108112-01, Transport Media, Added Handle with Care graphics to the I-box., Reason for Revision: Added customers for notification | Desktop Processors, Embedded Processors, Microcontrollers, Mobile Processors, Networking Products, Server Processors, Chipsets - Desktop, Chipsets - Workstation Server, Chipsets - Mobile | 888210 | HH80557PG0412M S LA3F | | | S LA3F | |
 | 108112-01 | All Intel(R) Component Products shipped in JEDEC trays using the Intermediate Box (I-Box) Packaging, PCN 108112-01, Transport Media, Added Handle with Care graphics to the I-box., Reason for Revision: Added customers for notification | Desktop Processors, Embedded Processors, Microcontrollers, Mobile Processors, Networking Products, Server Processors, Chipsets - Desktop, Chipsets - Workstation Server, Chipsets - Mobile | 888210 | HH80557PG0412M,SLA3F,888210 | | | S LA3F | |
 | 107548-00 | Intel(R) Core(TM)2 Duo Desktop Processor E4400, PCN 107548-00, Product Design, L-2 to M-0 Stepping Conversion | Desktop Processors | 888210 | HH80557PG0412M | HH80557PG0412M S LA3F | 890243 | S LA3F | SLA98 |